AI Hardware & Infrastructure · 20 Oct 2026 · 15:00 CEST
xMEMS Begins Mass Production of Solid-State Cooling Chips for AI Glasses and Data Center Hardware

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Putting more AI processing into a pair of glasses or a smartphone creates a problem that faster silicon alone cannot solve: the heat has to go somewhere. xMEMS Labs is moving its solid-state micro-cooling technology into mass production, targeting devices too thin for a conventional fan and small data center components that need airflow close to a hotspot.
The Santa Clara company says production has begun for its XMC-2400 and XMC-4800 µCooling chips. The first commercial products featuring XMC-2400 are expected in early 2027. That separates the manufacturing milestone from consumer availability: mass production of a component does not mean a finished phone, headset, or storage device is already on sale.
The two chips address different thermal budgets. XMC-2400 is intended for compact edge devices, including AI and XR glasses and personal SSDs. XMC-4800 provides more airflow for smartphones, enterprise SSDs, and other lower-power data center subsystems.
The technology uses xMEMS’ piezoMEMS semiconductor platform to generate directed airflow without rotating blades or bearings. The company describes an all-silicon architecture that can move air through narrow microchannels and sit near processors, memory, storage controllers, and other heat-generating components.
The company’s technical overview explains the mechanism in more detail. Thin-film piezoelectric material on silicon expands and contracts at ultrasonic frequencies. Microscopic membranes and valve arrays turn that motion into air pulses, while top- or side-venting packages direct the flow toward the target.
“Solid-state” therefore describes the absence of a traditional spinning fan assembly, not an absence of physical motion. The airflow comes from tiny vibrating structures. That distinction matters when comparing the device with passive materials, which spread heat but do not actively pump air.
The supplied production release lists the following specifications, which also match the current product page.
Source
Unite.AI · 20 Oct 2026 · 15:00 CEST
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